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BT / Metalloys Solder WireWhat It Is
BT / Metalloys solder wire is a wire made from a fusible metal alloy used in soldering to create electrical/mechanical bonds between metal parts. It often has a flux core (rosin or no‑clean style) to help with wetting and reducing oxidation.
Key Features & Specifications (Typical)ParameterTypical ValuesAlloy CompositionOften 60/40 tin‑lead (Sn60Pb40) or 63/37 SnPb, or sometimes lead‑free alloys depending on product line.  Flux CoreFrequently a rosin flux core; may also be “no‑clean” flux depending on variant. Wire Gauge / DiameterCommon in 22 SWG (≈ 0.7‑0.8 mm) or around that size; also available in other gauges. Melting PointFor eutectic tin‑lead alloys: ~ 183°C (~361°F). Slightly higher for non‑eutectic or lead‑free alloys. Physical AppearanceShiny metallic (silver color), often with flux core visible or marked; solid wire spool or roll format.PackagingSpools or rolls, weights from small (e.g. 20‑50 g) to larger sizes. Advantages / Why Use It

Good electrical conductivity for joints.

Suitable for electronics, electrical wiring, repairs, and general‑purpose soldering.

Flux core helps with easier soldering (less separate flux needed).

Eutectic alloy (like Sn63Pb37) gives sharp melting behavior (solid to liquid without pasty start), helpful for clean joints.

Limitations / Considerations
 

If it’s a leaded solder (Sn‑Pb), handling requires care (lead is toxic) and may not be allowed in all jurisdictions or applications (RoHS etc.).

Flux residue may need cleaning, especially if not no‑clean flux.

Wire diameter matters: thick wire can overheat small parts; thin wire takes longer to solder large parts.

Lead‑free variants require higher temperature and sometimes different soldering iron tip/flux.

22 SWG 60/40 Tin/Lead Solder Stick

The 22 SWG 60/40 Tin/Lead Solder Stick is a solid soldering alloy composed of 60% tin (Sn) and 40% lead (Pb). It is typically used in electronics, electrical repair, and metal joining processes where high-quality, reliable solder joints are required. Unlike solder wire, solder sticks do not contain flux, so external flux application is necessary during soldering.

Technical Specifications Key Features

• ✅ Eutectic Behavior: Near-eutectic alloy (60/40) for reliable melting and solidification with minimal pasty range.

• 🔥 Excellent Wetting: Provides good flow and wetting on copper and tin-plated surfaces.

• 🛠️ Versatile Use: Suitable for dip soldering, wave soldering, hand soldering (with external flux).

• 🔧 Consistent Quality: Manufactured for uniform alloy composition and clean finish.

Applications

• Electrical & Electronic Assembly

• Transformer and Coil Soldering

• Connector Tinning

• General Metal Joining

• Repair & Rework Operations

Usage Note

Since the stick is solid (i.e. without flux core), a separate flux (rosin-based or water-soluble) must be applied during soldering to:

• Remove oxides from metal surfaces,

• Promote solder flow, and

• Prevent cold joints or poor adhesion.

Storage & Safety

• 🔒 Store in a dry, cool area to prevent oxidation.

• ⚠️ Contains lead – use only in non-RoHS (non-lead-free) compliant applications.

• 🧤 Use personal protective equipment (PPE) and proper ventilation when soldering to avoid inhaling fumes.

 
Features:
 
Rugged design
Perfect finish
High strength